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Showing 1 to 2 of 2 for “"Flip-Chip-Technologie"”.
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Integration of ultrathin silicon chips
… work the mechanical behavior of ultrahin silicon chips during gold/tin bump reflow and during flip chip soldering onto polyimide tapes was analyzed. The experiments and analyses are a contribution to the research area of flex systems based on solder connections between extremely thin chips and …
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Entwicklung und Optimierung von HF-Mikrofederkontaktelementen zur temporären Kontaktierung von Mikrosystemkomponenten
… components with a studbump the component is fip-chiped on top of the microsprings. The electrical contact is then achieved by applying a sufficient contact force. Mechanical tolerances can be equalized by the microsprings. If required, the temporary contacts can be converted to permanent contacts …