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Showing 1 to 1 of 1 for “"Finite Element Thermal Modeling"”.
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Thermal Characterization of Die-Attach Degradation in the Power MOSFET
The thermal performance of the power MOSFET module is subject to change over its lifetime. This is caused by the growth of voids and other defects in the die-attach layer. The goal of this dissertation is to develop measurement techniques and finite element simulations that can measure the changes …