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Showing 1 to 14 of 14 for “"FinFETs"”.

  1. High-resolution transmission electron microscopy of III-V FinFETs

    … performance. III-V fin field-effect transistors (finFETs) have displayed impressive characteristics but have shown degradation in performance as the fin width is scaled to the sub-10-nm regime. In this work, we use high-resolution transmission electron microscopy (HRTEM) in an effort to understand …

    mit Repository record for High-resolution transmission electron microscopy of III-V FinFETs (opens in a new tab)

  2. Monte Carlo device modeling of 3D n-FinFETs to investigate heat generation

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01

    uiuc Repository record for Monte Carlo device modeling of 3D n-FinFETs to investigate heat generation (opens in a new tab)

  3. Novel Structures for Scalable Vertical Gallium Nitride Power Devices

    … enable self-aligned fabrication of vertical GaN finFETs and related devices. Within this work, we also explore the scalability of vertical GaN finFETs. Working with 8-inch GaN substrates, we demonstrate that vertical finFETs can be fabricated using a fully CMOS compatible process flow. This …

    mit Repository record for Novel Structures for Scalable Vertical Gallium Nitride Power Devices (opens in a new tab)

  4. Development of vertical bulk gallium nitride power devices

    … fabrication technologies for vertical power FinFETs. Key processing stesps are refined and demonstrated on large-area devices. The final topic covered is GaN superjunction (SJ) technology in the context vertical power FinFETs. The SJ FinFET concept is first introduced then an underutilized …

    mit Repository record for Development of vertical bulk gallium nitride power devices (opens in a new tab)

  5. Antimonide-based III-V multigate transistors

    … technological challenges for realizing InGaSb FinFETs have been overcome. First, a dry etching technique of heterostructures containing antimonide-based compounds has been developed. Etched fins and vertical nanowires show smooth, vertical sidewalls, high aspect ratio, and compatibility with …

    mit Repository record for Antimonide-based III-V multigate transistors (opens in a new tab)

  6. Static random-access memory designs based on different FinFET at lower technology node (7nm)

    … is essential for fault-free operation. FinFETs based on Design/Technology Co-Optimization (DTCO_F) approach can overcome these issues [38]. DTCO_F follows special design rules, which provides the specifications for the standard SRAM cells with special spacing rules and low leakages. The …

    umkc Repository record for Static random-access memory designs based on different FinFET at lower technology node (7nm) (opens in a new tab)

  7. Multigate MOSFETs for digital performance and high linearity, and their fabrication techniques

    … for 3D fin channel formation. InP junctionless FinFETs with record high-aspect-ratio (~ 50:1) fins are demonstrated by this method for the first time. The i-MacEtch process flow eliminates dry-etching-induced plasma damage, high energy ion implantation damage, and high temperature annealing, …

    uiuc Repository record for Multigate MOSFETs for digital performance and high linearity, and their fabrication techniques (opens in a new tab)

  8. Advanced III-V / Si nano-scale transistors and contacts: Modeling and analysis

    … in planar FETs and triple-gate non-planar FinFETs. (2) to demonstrate whether or not these technologies are viable alternatives to Si and conventional planar FETs. The simulation results indicate that III-V FETs do not outperform Si FETs in the ballistic transport regime, and triple-gate …

    purdue-thes Repository record for Advanced III-V / Si nano-scale transistors and contacts: Modeling and analysis (opens in a new tab)

  9. Study and development of low power consumption SRAMs on 28 nm FD-SOI CMOS process

    … silicon-oninsulator (FD-SOI), Multigate MOSFET, FinFETs, among others, and new design techniques emerge by taking advantage of the improved features of these devices. This thesis focused on the development of analytical expressions for the major performance parameters of the SRAM cache …

    brazil-uerj Repository record for Study and development of low power consumption SRAMs on 28 nm FD-SOI CMOS process (opens in a new tab)

  10. Modelling and enhancement of the channel mobility of 4H-SiC power MOS devices

    … the great inherent potential of the SiC FinFETs, this study provides further impulse to the development of more advanced practical designs that can finally solve the issues which SiC MOS devices face in the channel.

    cambridge Repository record for Modelling and enhancement of the channel mobility of 4H-SiC power MOS devices (opens in a new tab)

  11. Gate-Oxide-Short Defect Analysis and Fault Modeling Based on FinFET's 3D Structure

    … for GOS defect injection and fault modeling in FinFETs by introducing the defect to a 3D structure of the device for a specific process technology. The behavior of the defective device is captured through simulations in Sentaurus TCAD environment that lead to the generation of more accurate …

    carleton Repository record for Gate-Oxide-Short Defect Analysis and Fault Modeling Based on FinFET's 3D Structure (opens in a new tab)

  12. Design, Modeling and Analysis of Non-classical Field Effect Transistors

    … (SOI) and body-on-insulator (BOI) FinFETs are simulated to demonstrate their impact on the performance of volatile memory SRAM module with consideration of self-heating effects. Comprehensive simulation results suggest that the current drivability degradation due to increased device …

    syracuse-diss Repository record for Design, Modeling and Analysis of Non-classical Field Effect Transistors (opens in a new tab)

  13. Performance variations due to layout-dependent stress in VLSI circuits

    … owing to the three dimensional nature of the FinFETs, the beneficial stress relaxes along the free-edges of standard cell layouts. Thus, the magnitudes of engineered mechanical stress depend upon the underlying layout topology. To improve circuit performance, a dual gate pitch technique is …

    umn Repository record for Performance variations due to layout-dependent stress in VLSI circuits (opens in a new tab)