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Showing 1 to 2 of 2 for “"Falling Wedge Test"”.
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Time- and Temperature-Dependence of Fracture Energies Attributed to Copper/Epoxy Bonds
… the bond when it is broken. Since the 90° peel test has been widely employed in quasi-static fracture testing of film adhesion for printed circuit board applications, this test was first used as a basis to which other test results could be compared. A test fixture was designed and built for …
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Evaluating Thermal and Mechanical Properties of Electrically Conductive Adhesives for Electronic Applications
… evaluated. All the samples for both mechanical tests and thermal tests were aged at 85%, 100%RH for periods of up to 50 days. Studies of bulk conductive adhesives suggested that both plasticization, which is reversible and further crosslinking and thermal degradation, which are irreversible, …