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Showing 1 to 11 of 11 for “"Engineering, Packaging"”.

  1. Production of Zein From Dry Milled Corn by Solvent Extraction and Ultrafiltration

    The process developed here can be easily integrated into any corn processing facility, especially dry-grind ethanol plants. The solvent extraction step involves only mixing and a filtration/centrifugation step. The filtered extract, after further treatment if necessary to improve protein purity, …

    uiuc Repository record for Production of Zein From Dry Milled Corn by Solvent Extraction and Ultrafiltration (opens in a new tab)

  2. Drying Oils Treated by Irradiation as Coatings for Biobased Films

    Biobased films are potential food packaging materials. However, their performance with respect to water and gas barrier properties is inferior to current packaging products on market. Drying oils are promising as film coatings to improve water barrier properties of protein-based films. Drying oils …

    uiuc Repository record for Drying Oils Treated by Irradiation as Coatings for Biobased Films (opens in a new tab)

  3. Preparation and Properties of Flexible Resin Sheets From Zein

    … potentially useful for manufacturing flexible packaging materials. Methods of plasticizer incorporation influenced effectiveness of plasticization. Stabilizing and enhancing of plasticizer-zein complexes are crucial to accomplish plasticization.

    uiuc Repository record for Preparation and Properties of Flexible Resin Sheets From Zein (opens in a new tab)

  4. Preparation of Zein-Based Biodegradable Materials and Investigation of Their Physical Properties

    Plasticization was improved by dissolving zein and fatty acids in warm aqueous alcohol solutions. Resins were obtained through precipitation and kneading treatments. Inclusion of palmitic and stearic acid in the formulation resulted in harder resins that were suited for rolling into sheets; whereas …

    uiuc Repository record for Preparation of Zein-Based Biodegradable Materials and Investigation of Their Physical Properties (opens in a new tab)

  5. Design of Improved Polyester Dielectric Insulators for Electronic Packaging

    First, the foaming methods used to lower the dielectric constant of the copolyester thermoset to 2.5 $\rm (25\sp\circ C,$ 1 kHz) are described. Second, the nature of the increase in melting temperature of the liquid crystalline copolyesters upon annealing near their original melting temperature to …

    uiuc Repository record for Design of Improved Polyester Dielectric Insulators for Electronic Packaging (opens in a new tab)

  6. Finite Element Analysis of Multilayer Transmission Lines and Circuit Components

    … integrated circuits, and electronic circuit packaging and interconnects. Some difficulties encountered in numerical simulations are tackled with special treatments. First, a generalized eigenvalue problem for inhomogeneous multilayer transmission lines is formulated with the full-wave finite …

    uiuc Repository record for Finite Element Analysis of Multilayer Transmission Lines and Circuit Components (opens in a new tab)

  7. Models for Yield Estimation of Multichip Module Ceramic Substrates

    We present improved yield models that can be used for a broader range of printed patterns. We also enhance the defect geometry models that are commonly used today. We introduce a defect geometry model that is based on the physical process of defect formation. Our defect geometry model employs …

    uiuc Repository record for Models for Yield Estimation of Multichip Module Ceramic Substrates (opens in a new tab)

  8. Novel Methodologies and Measurement Software for Transistor Amplifier Synthesis in Planar Coupled -Transmission Lines

    This thesis concerns the synthesis of active devices in coupled-microstrip and coupled-coplanar technology. We first discuss several aspects of multiconductor transmission line (MTL) theory, including longitudinal dependencies of immittance functions. We next describe a frequency domain normal mode …

    uiuc Repository record for Novel Methodologies and Measurement Software for Transistor Amplifier Synthesis in Planar Coupled -Transmission Lines (opens in a new tab)

  9. Design guidelines and synthesis of a low dielectric constant inorganic composite for high performance microelectronic packaging

    This thesis is on theoretical and experimental studies of a controlled porosity inorganic composite using hollow ceramic microspheres. It evaluated the microsphere geometry issues and physical/electrical properties important to achieving a maximum reduction of the dielectric constant of the …

    uiuc Repository record for Design guidelines and synthesis of a low dielectric constant inorganic composite for high performance microelectronic packaging (opens in a new tab)

  10. Effects of misting and modified atmosphere packaging on nutrient and market quality of broccoli

    Restriction data tranferred 2014-07-01T11:15:51-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission

    uiuc Repository record for Effects of misting and modified atmosphere packaging on nutrient and market quality of broccoli (opens in a new tab)

  11. Production of Zein From Dry Milled Corn by Solvent Extraction and Ultrafiltration

    This research focused on developing a process for the production of low cost zein from corn using a combination of solvent extraction and membrane technology. Extraction of zein from dry milled whole corn was optimum with 70% ethanol at 50°C using a solvent-to-solids ratio of 6 ml ethanol per g …

    uiuc Repository record for Production of Zein From Dry Milled Corn by Solvent Extraction and Ultrafiltration (opens in a new tab)