Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 29 for “"Electronics Packaging"”.
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Design and Analyses of a Dimple Array Interconnect Technique for Power Electronics Packaging
… thermal and mechanical characteristics for power electronics applications. In the DAI structure, electrical connections onto the devices are achieved by solder bumps formed between the silicon device and arrays of dimples stamped on a metal sheet flex. This research first presents the design of …
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Development of a process for the production of fluxless solder spheres for BGA electronics packaging
… solder spheres for BGA (Ball Grid Array) microelectronics packaging technology. The Uniform Droplet Spray (UDS) process produces solder spheres by controlling the breakup of a continuous laminar jet into uniform droplets. which are then rapidly solidified in a liquid bath or an inert gas. This …
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Control of the UDS process for the production of solder balls for BGA electronics packaging
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1997.
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Experimental and modelling analysis on the performance of anisotropic conductive films as used in electronics packaging
… and has gained extensive interest in the electronics packaging industry. Both the experimental and finite element analysis (FEA) methods were used in order to investigate the behaviour of the ACF materials when subjected to certain manufacturing and environmental testing conditions. The …
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Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
This study focused on the development and evaluation of die-attach material and substrate technology for high-temperature applications. For the die-attach material, a low-temperature sintering technique enabled by a nanoscale silver paste was developed for attaching large-area (>100 mm2) …
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Miniaturizing microvias for multi-chip modules
Electronics packaging is continually migrating toward denser packaging. This encompasses a push toward multilevel die, denser metallization, and smaller microvias. In this thesis we investigate the miniaturization of laser-drilled microvias in polyimide dielectric for chips-first multi-chip module …
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Development of Cu particle sintering as die attach solution for high temperature electronics applications
… as Die Attach Solution for High Temperature Electronics Applications”, submitted to TU Berlin, investigates innovative copper (Cu) sintering techniques for die-attach applications in high-temperature electronics, particularly for wide bandgap semiconductors like silicon carbide (SiC). The …
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Volume Mount Devices
… resources, the limitations of two-dimensional electronics integration have become critical bottlenecks. Surface-mount devices (SMDs) remain entrenched in industry practice despite being insufficient for today's computing challenges and sustainability needs. This thesis introduces the volume …
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Design of experiment analysis of an electronics package lid using finite element analysis
… using finite element analysis of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to …
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Nucleation and growth kinetics of tin and tin -silver alloy during initial stages of electrodeposition
… has played an essential role in electronics packaging because it gives superior thickness control for chip interconnects. Pure tin, tin-silver and tin-silver-based solders have been identified as leading candidates for lead-free solders due to the desirable melting point, good …
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Design, Analysis and Experimental Verification of a Mechanically Compliant Interface for Fabricating Reliable, Double-Side Cooled, High Temperature, Sintered Silver Interconnected Power Modules
This research developed a double-side power electronics packaging scheme for high temperature applications exemplified by 1200 V, 150 A silicon devices. The power modules, based on both quarter and half-bridge topologies, were assembled using sintered silver device attachment rather than …
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Packaging of the MIT Microengine
… thesis covers the development and testing of the packaging needed for the microengine and related devices. The packaging of the microengine includes the fluidic, electrical, and sensor connections that interface the engine with the supplies and instruments necessary for operation. Making …
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Selective Deposition of Copper Traces onto Additively Manufactured All-Aromatic Polyimides via Laser Induced Graphene to Enable Conformal Printed Electronics
… technologies to create additively manufactured electronics (AME) has enabled the integration of electrical functionality to form multifunctional AM components. Current work in AME has demonstrated the integration of conductive traces into and onto geometries and form factors that are not …
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Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
Die-attachment, as the first level of electronics packaging, plays a key role for the overall performance of the power electronics packages. Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and …
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Development of hybrid inorganic/organic nanocomposites with enhanced thermal conductivity
… challenge across technologies such as microelectronics, automotive, and aerospace systems. In advanced electronics, continual miniaturization and rising power density intensify local heat generation; if heat is not removed and redistributed efficiently, overheating can degrade performance, …
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Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
… role in electronic products as the integrity of electronics packaging and assembly rests on the quality of these connections. The increasing demands for higher performance, lower cost, and miniaturisation in hand-held and consumer electronic products have led to the use of dense interconnections. …
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Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress
… stress for high density integration of power electronics systems. With the development semiconductor technology, the heat flux generated in power device keeps increasing. As a result, more and more stringent requirements were imposed on the thermal and reliability design of power electronics …
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Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies
Flip chip interconnections have superior performance for microwave applications compared to wire bond interconnections because of their reduced parasitics, more compact architecture, and flexibility in laying out flip chip bond pads. Reduction in interconnect parasitics enables these interconnects …
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Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules
… processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure …
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