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Showing 1 to 1 of 1 for “"Electronic packaging-- Materials--Fatigue"”.
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Predicting adhesive failure initiation of an epoxy bond for electronic packaging survivability
Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. Data from epoxy bond …