Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 49 for “"Electronic packaging"”.
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Design of Improved Polyester Dielectric Insulators for Electronic Packaging
First, the foaming methods used to lower the dielectric constant of the copolyester thermoset to 2.5 $\rm (25\sp\circ C,$ 1 kHz) are described. Second, the nature of the increase in melting temperature of the liquid crystalline copolyesters upon annealing near their original melting temperature to …
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Low temperature transient liquid phase bonding for electronic packaging
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992.
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Electronic Packaging Strategies for High Current DC to DC Converters
Current trends in electronics are toward the use of reduced voltages. In the past, 5 V and higher voltages have been the standard, however, currently, 3.3V and 2.5V circuits are becoming increasingly common. While the operating voltage is decreasing, electronic systems are becoming more complex. …
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD …
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Predicting adhesive failure initiation of an epoxy bond for electronic packaging survivability
Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. Data from epoxy bond …
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Experimental and modelling studies of electronic packaging interconnections formed with lead-free materials
… the formation, quality and reliability of electronic packaging interconnections formed using solder alloys and anisotropic conductive films (ACFs). The wetting behaviours of new lead-free solders (i.e. Sn-2.8Ag-0.5Cu-1.0Bi and Sn-0.7Cu-0.3Ni) have been evaluated using the wetting balance …
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Controlling heat transfer in electronic packaging using thermal switches and high power thermal buffers
Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2022-04-06 without embargo terms
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Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects
… of ICAs in emerging applications such as printed electronics and solar cells.
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Optimisation modelling for microelectronics packaging and product design
… a design framework for virtual prototyping of electronic packaging. This framework couples computational mechanics and fluid dynamics, based on finite volume method with integrated finite element routines, with numerical optimisation and statistical methods. This integrated approach is intended …
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Characterization of the crystallinity and mechanical properties of CTFE & CTFE copolymeric films as a function of cooling rate and the implications on adhesion
… and CTFE copolymeric films are being used in the electronic packaging industry as insulating dielectric layers between microwave circuits. Since these films are semicrystalline and, in this application, are being used as hot melt adhesives, the cooling rate is an important processing variable, …
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Graphene Oxides and Related Applications
… to be used in many fields like, for instance, electronic packaging and water treatment.
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Multiphysics Design and Modeling for Advanced Packaging and Heterogeneous Integration of Power Delivery
… in integrated power delivery for advanced electronic packaging and heterogeneous integration architectures. Embedded inductors, essential for efficient power delivery, must maintain high performance at elevated temperatures, minimizing Joule heating and inductance loss. Designing such …
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Thin Film Polymer Dielectrics for High-Voltage Applications under Severe Environments
… dielectrics for the realization of high-power electronic circuits in a miniature form. These polymeric materials must satisfy a number of critical thermal, environmental, and electrical requirements to meet the required performance criteria for microelectronics applications. These desired …
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Measuring Characteristic Shrinkage Variability Due to Metal Loading Effects in Low Temperature Co-Fired Ceramic Using Image Processing
… (LTCC) has many benefits when it comes to electronic packaging due to the low dielectric loss, reliability in extreme environments, and high breakdown voltage. Though the ceramic has a lot of benefits it is not widely used due to the high cost and complexities associated with manufacturing. …
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Nonlinear Polymer Nanocomposite for Field Grading in Medium-Voltage Power Converters under High-Altitude and Humid Environments
… reliability in high-power, high-voltage electronic packaging applications.
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Indentation vs. Uniaxial Power-law Creep of Sn-based Solder Material: A Numerical Assessment
… the creep behavior of Pb-free solder alloys in electronic packaging. Typical service environments are between 298 and 373K. The thermal mismatch induced stresses acting on solder joints result in extensive rate-dependent plastic deformation. The solder alloy is potentially the weakest component …
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Computational analysis of viscoelastic free surface flows
… two industrial flow processes as used in the electronic packaging industry.
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Numerical Investigation of the Structural Integrity of Silicon Carbide and Copper Heat Sink
… microchannels to transfer heat away from electronic components to a fluid coolant through forced convection. In our implementation of the heat sink, water passes through the microchannels. This configuration has direct applications to many microelectronic settings, specifically 2.5D …
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Processing to Enable Direct-Write Additive Manufacturing of Ceramics and Ceramic Composites
… established considerations for co-DIW of ceramic electronic packaging technologies. Low temperature co-fired ceramic (LTCC) structures were demonstrated by co-printing but were not successfully post-processed due to mismatched co-drying. In graded printing, a Mo (φ = 0.45) paste was developed to …
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Piezo-induced fatigue of solder joints
… the damage mechanisms in solder joints for electronic packaging applications under cyclic loading conditions. Analytical results are derived for the plastic shear strain at the free edges of such a specimen using a shear lag model. Results are also presented for the strain energy release …
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