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Showing 1 to 1 of 1 for “"Double-sided die"”.
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Development of Bi-Directional Module using Wafer-Bonded Chips
Double-sided module exhibits electrical and thermal characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided …