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Showing 1 to 1 of 1 for “"Disbond detection"”.
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Structural Health Monitoring of Adhesively Bonded Joints With Piezoelectric Wafer Active Sensors
… the electromechanical impedance method for disbond detection. The electromechanical impedance (EMI) method was modeled extensively with analytical and finite element method; the theoretical predictions were compared with carefully conducted experiments on geometrically tractable specimens. …