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Showing 1 to 1 of 1 for “"Dielectric fill"”.
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Coating and filling of nanometer-scale structures using chemical vapor deposition
Void-free filling of high aspect ratio (AR = 3 to 10) structures, such as trenches or vias, is necessary in nanoscale device fabrication. Examples include shallow trench isolation, metallization, and reverse tone patterning in integrated circuits and optical waveguides in photonic devices. …