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Showing 1 to 6 of 6 for “"Dielectric Fluids"”.

  1. Nanoscale modification of key surface parameters to augment pool boiling heat transfer and critical heat flux in water and dielectric fluids

    … the pool boiling characteristics of various fluids, and demonstrates that surface effects can drastically alter the nucleate boiling heat transfer coefficient as well as the critical heat flux. Changes in surface morphology and surface chemistry are suspected to be the primary factors …

    mit Repository record for Nanoscale modification of key surface parameters to augment pool boiling heat transfer and critical heat flux in water and dielectric fluids (opens in a new tab)

  2. Exploring water-in-oil emulsions for immersion cooling: thermophysical properties, electrical insulation, and chip-level performance

    … cooling of high-power electronics. Conventional dielectric oils provide good insulation but low thermal conductivity, which limits chip-level heat dissipation. A property-based figure of merit for natural convection is derived to assess how density, heat capacity, thermal conductivity, thermal …

    uiuc Repository record for Exploring water-in-oil emulsions for immersion cooling: thermophysical properties, electrical insulation, and chip-level performance (opens in a new tab)

  3. Palladium Catalyzed Hydrodechlorination of 4-Chloroanisole in Phosphonium Ionic Liquids

    … in closed or semi-closed systems such as dielectric fluids for transformers and capacitors, or are still present in the environment. The continued presence of PCBs is problematic, due to their toxicity. Their hydrophobic nature and resistance towards metabolism leads to bio-accumulation up …

    brockport Repository record for Palladium Catalyzed Hydrodechlorination of 4-Chloroanisole in Phosphonium Ionic Liquids (opens in a new tab)

  4. Thermal-hydraulic characterization of single- and two-phase immersion cooling for electronic modules

    … safe cooling schemes. Immersion cooling in dielectric fluids has emerged as a promising approach to address these needs. By directly submerging electronic assemblies in a thermally stable, electrically insulating liquid, immersion cooling minimizes thermal interface resistances and enables …

    uiuc Repository record for Thermal-hydraulic characterization of single- and two-phase immersion cooling for electronic modules (opens in a new tab)

  5. Design of device-integrated heat sinks for liquid immersion cooling applications

    Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2024-09-16 without embargo terms

    uiuc Repository record for Design of device-integrated heat sinks for liquid immersion cooling applications (opens in a new tab)

  6. Flow Boiling in Meso-Scale Pin-Fin Coldplates

    … assist in the design of two-phase coldplates. Dielectric fluid flow boiling in a millimeter-scale coldplate was experimentally investigated under non-uniform heating conditions, representing realistic heat dissipation scenarios for high-power-density applications such as electronics cooling. …

    gatech Repository record for Flow Boiling in Meso-Scale Pin-Fin Coldplates (opens in a new tab)