Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 4 of 4 for “"Die-shear strength"”.
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Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
Die-attachment, as the first level of electronics packaging, plays a key role for the overall performance of the power electronics packages. Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of …
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Development of Cu particle sintering as die attach solution for high temperature electronics applications
… thesis, “Development of Cu Particle Sintering as Die Attach Solution for High Temperature Electronics Applications”, submitted to TU Berlin, investigates innovative copper (Cu) sintering techniques for die-attach applications in high-temperature electronics, particularly for wide bandgap …
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Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
… be used as a lead-free alternative to solder for die-attachment at sintering temperature below 300 °C without applying any pressure. Typically, the substrate, such as direct bond copper (DBC) substrates, has surface metallization such as silver or gold to protect the copper surface from oxidation …
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach …