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Showing 1 to 7 of 7 for “"Die-attachment"”.
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Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
Die-attachment, as the first level of electronics packaging, plays a key role for the overall performance of the power electronics packages. Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of …
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Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
… interconnection in electronic packages, chip attachment plays a key role in the total packaging process. Sintered nanosilver paste may be used as a lead-free alternative to solder for die-attachment at sintering temperature below 300 °C without applying any pressure. Typically, the substrate, …
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Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
… was developed for attaching 100 mm2 silicon die. This new lead-free packaging technique for die-attachment was compared with soldering by vacuum reflow. Lead-free solder SAC305 and SN100C were selected and used in this work since they were widely used in electronic packaging industry. …
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Characterization of Flexible Hybrid Electronics Using Stretchable Silver Ink and Ultra-Thin Silicon Die
… conductive inks paired with ultra-thin silicon die in theµm range was conducted. A silver based ink designed to be stretchable was screen printed on a TPU substrate and cured using box oven, conveyor convection oven, and photonic curing processes. Reliability tests were conducted including a …
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Processing melt blended polymer nanocomposites using a novel laboratory mini-mixer. Development of polymer nanocomposites in the melt phase using a novel mini-mixer.
… the molten polymer nanocomposite through a slit die attachment to the minimixer.
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A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer
… of which both top and bottom sides are used as die attachment surfaces, the SiC MOSFET bare dies are flip-chip attached on the LTCC interposer using nickel-plated copper balls, high horizontally thermal conductive material is integrated into the LTCC interposer to improve its thermal dissipation …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
Die attachment is one of the most important processes in the packaging of power semiconductor devices. The current die-attach materials/techniques, including conductive adhesives and reflowed solders, can not meet the advance of power conversation application. Silver paste sintering has been widely …