Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 3 of 3 for “"Die-attach process"”.
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Process development for high powered amplifier Au/Sn eutectic die attach via vacuum furnace
… monolithic microwave integrated circuit die attach process. Research was done to understand the causes and effects of voiding levels on device performance and reliability. Simultaneous investigation was done to qualify vacuum-attach as a successful methodology by which minimal voiding …
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UBM Formation on Single Die/Dice for Flip Chip Applications
This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between …
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to …