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Showing 1 to 4 of 4 for “"Die-attach materials"”.
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal …
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Sintering behavior of Ag-Sn alloys prepared via cryogenic high-energy ball milling
… there is a need to develop high temperature die-attach materials that are mechanically stable at operating temperatures of 300◦C and provide excellent thermal conductivity between die and substrate materials. There are no obvious choices for all applications, however, low temperature …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
Die attachment is one of the most important processes in the packaging of power semiconductor devices. The current die-attach materials/techniques, including conductive adhesives and reflowed solders, can not meet the advance of power conversation application. Silver paste sintering has been widely …
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Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress
… performance and reliability of three different die-attach materials. From the prediction of the proposed thermal model, it was found that the conventional single-sided power module with wirebond connection cannot achieve both good steady-state and transient thermal performance under high heat …