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Showing 1 to 2 of 2 for “"Deformation (Mechanics)Plasticity"”.
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
… electronic devices. Misalignment induced shear deformation of the through-silicon vias (TSV) and solder micro-bumps are simulated through an applied shearing action. Thermal effects due to coefficient of thermal expansion (CTE) mismatch during processing are also studied to provide trends of …
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Numerical analysis of plastic deformation in metal-ceramic nanolayers during cyclic indentation
… objective of examining the evolving plastic deformation in the ductile metal constrained by the hard ceramic layers. An axisymmetric model consisting of alternating aluminum (Al) and silicon carbide (SiC) thin films on a silicon (Si) substrate is indented by a conical diamond indenter. In …