Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 2 of 2 for “"Daisy-chain resistance"”.
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… the MIL-STD-885 method. The overall wire-bond daisy-chain resistance change was 0.47% after the Venus simulator test, indicating a promising wire bond integrity. A titanium package was fabricated to house the ceramic packaging substrate and a two-level metalized feedthrough was fabricated to …
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Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect
Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias …