Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 17 of 17 for “"Cu surface"”.
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In Situ Vibrational Spectroscopic and Electrochemical Study of Electrodeposition Additives on Copper Surfaces
… 12O404-, on copper, silver, and gold electrode surfaces was investigated using SERS and PM-IRRAS. The results show that silicotungstate interacts with Cu surfaces. This interaction is shown to be potential-dependent; alpha-SiW12O404- associates with the Cu surface to a greater extent as the …
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Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
… of die-attachment on silver (Ag) or gold (Au) surfaces by pressure-less or low-pressure (< 5 MPa) nanosilver sintering. This study extended the application of nanosilver sintering die-attach technique to copper (Cu) surface. The main challenge of nanosilver sintering on Cu is the formation of …
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CORROSION PROTECTION OF COPPER IN OILY MEDIA: MICROSCOPIC MECHANISMS
… industrial-grade corrosion inhibitor (CI) for Cu. This PhD project developed an understanding on the microscopic mechanisms for the TTAH adsorption on Cu, and the effective protection against sulfide-attack in oily medium analogous to automotive lubricants.XPS and ToF-SIMS characterization were …
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Area selective atomic layer deposition of silicon dioxide on silicon dioxide using surface passivation of copper non-growth surface
… in growth during ALD, an inhibitor molecule is required to functionalize the non-growth surface prior to ALD process. This bottom-up surface selective variant of ALD is area selective ALD and can be widely used in structures during device processing. In this thesis work, we have …
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Scratching by pad asperities in chemical mechanical polishing
… number of components in a typical integrated circuit, known as Moore's Law, is driving the need for improvements in manufacturing. A key semiconductor manufacturing process is chemical-mechanical polishing (CMP), which is used to create connecting metal channels above the transistors in a chip. A …
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FTIR-ATR Characterization of Hydrogel, Polymer Films, Protein Immobilization and Benzotriazole Adsorption on Copper Surface
… amine and carboxylic groups are used as solid surface for the immobilization of bovine serum albumin (BSA). Pulsed plasma polymerization was used to polymerize these monomers with different duty cycles. Initial works in this field were all about protein surface adsorption. But more recently, …
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Electrochemical Synthesis and Characterisation of Multimetallic Nanostructured Electrocatalysts
… Electrochemical pathways involved sequential surface-limited redox-replacement (SLRR) reactions of underpotentially-deposited or overpotentially-deposited copper, potentiostatic dealloying, direct spontaneous deposition of noble metals (without intermediary steps involving redox-replacement …
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A Study on Catalytic Sites Contiguity in Cu-ZnO-Based Catalysts for CO2 Hydrogenation to Methanol
… CO2 hydrogenation to methanol (MeOH) in various Cu–ZnO systems. Three phases are formulated as follows. Phase 1 studied the CSC of atomically-dispersed ZnO-Cu/SiO2 catalysts for improving MeOH formation. Using the atomic layer deposition (ALD), atomically dispersed ZnO (ADZn2+) sites were …
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Electrochemical and spectroscopic insights into the electroreduction of carbon dioxide to value added chemicals
… active catalysts for CO2 electroreduction and focuses on interrogating the electrocatalytic mechanisms for the CO2 conversion reaction through spectrochemical studies. Chapter 2 reports several high surface area Cu-based catalysts, prepared by the electro-deposition of Cu, Cu/Ag, and Cu/Sn alloy …
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Investigations of the Band Structure and Morphology of Nanostructured Surfaces
… graphene and electronic states created at the vacuum interface of single crystal copper surfaces. The characteristics of both electronic systems depend intimately on the morphology of the surfaces they inhabit. Thus, in addition to discussing the respective band structures of these systems, a …
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Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration
The shift to the Cu/low-k interconnect scheme requires the development of diffusion barrier/adhesion promoter materials that provide excellent performance in preventing the diffusion and intermixing of Cu into the adjacent dielectrics. The integration of Cu with low-k materials may decrease RC …
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Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
… such as direct bond copper (DBC) substrates, has surface metallization such as silver or gold to protect the copper surface from oxidation during the sintering process. This study focused on developing techniques for die-attachment on pure copper surface by low-temperature sintering of nanosilver …
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Effects of Water-Soluble Binders on Direct Ink Writing Silicon Anode in Lithium-Ion Batteries
… of a Li-ion battery is the anode material. The current anode material that is commonly being used in the present market is graphite on copper foil, which is effective but is expensive, has limited availability, and the theoretical specific capacity is only 327 mAh/g. Studying materials that are …
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Investigation of the Surface-Electrolyte Interface of Semiconductors and Metals
This thesis focuses upon investigating the interface between semiconductors or metals with electrolyte. Understanding the interfacial dynamics are important to improving process performance, whether investigating photocatalytic systems or the nature of adsorption and reaction dynamics on metal …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of high density, functionality and performance of electronic devices. With the increase in …
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Spectroelectrochemical investigation of passive layers formed on electrode surfaces
… gives the breakdown potentials and corrosion currents, and AC impedance, from which film resistance and inhibition efficacy can be determined. Although voltammetry gives an idea of whether a film successfully passivates a metal surface, it gives little insight into the mechanism of inhibition …
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Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling
… heated, 10 x 10 x 1.6 mm rough and dimpled Cu surfaces. Fabricating these surfaces is cost effective and scalable, making them suitable for immersion nucleate boiling cooling of high powered microprocessors requiring heat spreaders of different sizes. The PF-5060 has a saturation temperature …