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Showing 1 to 1 of 1 for “"Copper Seed"”.
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Comparison of high power impulse magnetron sputtering and modulated pulsed power sputtering for interconnect metallization
… deposition is used to deposit the barrier and seed layers in the state of the art interlevel metallization process. As the critical dimension keeps shrinking, it has become increasingly difficult to use the current techniques to form thin, continuous and stable barrier/seed layers, and more …