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Showing 1 to 20 of 24 for “"Copper Electrodeposition"”.
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Application of voltammetry to copper electrodeposition
… electron microscopy techniques to characterize copper deposition from an acid-sulfate electrolyte. The main process variables investigated were temperature and addition agents (chloride ion, glue, separan or thiourea) at different concentrations, over a range of current densities. Cathodes …
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Multiscale Simulation and Optimization of Copper Electrodeposition
Two parallel KMC algorithms were also developed for the simulation of electrochemical nucleation and growth. Compared to the regular serial KMC algorithm, the developed parallel algorithms are able to speedup simulations and study large systems which may not be addressed by a single processor due …
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Localized adsorption of organic additives during copper electrodeposition
… potential up to $-$750 mV (SSE). During Cu electrodeposition at $-$550 mV and at $-$650 mV (SSE), adsorbed DiOC$\sb6$(3) restricted nucleation of Cu to a small number of active sites, where Cu grew hemispherically, and DiOC$\sb6$(3) adsorption was maintained across regions where nucleation …
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Investigating surface behavior of copper electrodeposition electrolytes and additives
DSpace SAF Submission Ingestion Package generated from Vireo submission #14012 on 2019-11-26 at 13:59:34
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Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate
… properties of sub monolayer and monolayer of copper deposition on the polycrystalline iridium, ruthenium and its conductive oxide. The electrochemical methods cyclic voltammetry (CV) and chronocoulometry were used to study the under potential deposition. The electrochemical methods to oxidize …
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Interfacial Study of Copper Electrodeposition with the Electrochemical Quartz Crystal Microbalance (EQCM)
… for metal interconnects. Characterization of copper underpotential deposition (UPD) on ruthenium and RuO2 electrodes by means of electrochemical methods and other spectroscopic methods is presented. Copper electrodeposition in platinum and ruthenium substrates is investigated at pH values …
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Effect of water on copper electrodeposition from water-containing deep eutectic solvents
Metal electrodeposition is mostly based on aqueous systems which sometimes require the addition of chemicals that can be hazardous for the environment. Due to growing environmental regulations, Ionic Liquids (ILs) have been investigated as an alternative electrochemical media for this process. …
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MPSA Effects on Copper Electrodeposition: Understanding Molecular Behavior at the Electrochemical Interface
… at flat non-specific solid surfaces and copper metal electrodes. <em>Ab initio</em> quantum-mechanical calculations are reported and define the interatomic potentials in the simulations. Some of the quantum-mechanical calculations involve small copper clusters interacting with …
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Multiscale Simulations of Nanofabricated Structures: Application to Copper Electrodeposition for Electronic Devices
*This dissertation is a compound document (contains both a paper copy and a CD as part of the dissertation). The CD requires the following system requirements: Microsoft Office.
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In situ studies of copper electrodeposition in the presence of organic additives using atomic force microscopy
In the present study we investigated electrodeposition of Cu from sulfuric acid solutions. Three different substrates were used to investigate the effect of various variables on electrodeposition.
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Study of Copper Electrodeposition on Ruthenium Oxide Surfaces and Bimetallic Corrosion of Copper/Ruthenium in Gallic Acid Solution
… In this study, we were focusing on the effect of copper electrodeposition on each type of oxides. From decreased charge of anodic stripping peaks and underpotential deposition (UPD) waves in cyclic voltammetry (CV), efficiency of Cu deposition dropped off indicating that interfacial binding …
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Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers
… of the effect of plating solution additives on copper nucleation on ruthenium films. This investigation contributes procedures for quantitative characterization of the effect of additives on early stages of copper electrodeposition on ruthenium substrates. Such procedures will enable improved …
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Investigation of the Influence of a Model Additive System on Copper Electrodeposition: Integration of Experiments on the Surface Morphology Evolution With Multiscale Simulation
In the last chapter, copper electroplating behavior on electrodeposited ruthenium surface was briefly discussed.
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Multiscale Systems Theory With Application to Electrodeposition and Crystallization Process
… multiscale reacting systems with application to copper electrodeposition. Chemical reacting systems involve phenomena that span several orders of magnitude in time and length scales, from the molecular to the macroscopic. To account for the multiscale character of these processes, many papers …
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In Situ Studies of Corrosion and Electrodeposition Using Atomic Force Microscopy
… force microscopy was used to study corrosion and electrodeposition on a nanoscopic level. Dissolution of copper was crystallographic in 0.5 M H$\sb2$SO$\sb4$ at overpotentials up to 100 mV; addition of BTA provided corrosion inhibition up to 300 mV overpotential, where pitting occurred. Surface …
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Interfacial Electrochemistry and Surface Characterization: Hydrogen Terminated Silicon, Electrolessly Deposited Palladium & Platinum on Pyrolyzed Photoresist Films and Electrodeposited Copper on Iridium
… candidate for investigation as a new generation copper diffusion barrier for the IC industry. Copper electrodeposition on iridium is studied to address the potential of iridium as a copper diffusion barrier. Copper electrodeposition is studied using a current-transient technique to obtain insight …
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Advanced electrochemical characterization of copper deposition
The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration …
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The development of magnetic tunnel junction fabrication techniques
… The decoration of pinholes and weak-links by copper electrodeposition was investigated. A new technique is presented to identify the number of copper deposits present in a thin insulating film. The effect of roughness, aluminium thickness and voltage on the number of pinholes and weak-links …
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Engineering Biological Materials for Carbon Capture and the Electrochemical Reduction of Carbon Dioxide to Light Hydrocarbons
… are light-crosslinked and metallized to create copper electrodes that explore the effect of pore structure on catalyst performance. Second, catalysts made via copper electrodeposition are modified by viral proteins to create nanostructured, crystalline electrodes that shift product distributions …
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Additive-Assisted Nucleation and Growth of Thin Films: Controlled Experiments and Multiscale Simulations
… seed cluster growth and wild nucleation during copper electrodeposition. Additive compositions that served to suppress the deposition rate (high chloride (10 ppm) and high PEG (3000 ppm)) slowed the deposition rate on the Cu seeds and increased the level of wild nucleation on the Au substrate. …
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