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Showing 1 to 3 of 3 for “"Co-Packaged Optics"”.
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PI AND EMI ANALYSIS OF 3D IC SYSTEM WITH TSVS AND CO-PACKAGED OPTICS
… high-power optical links for data center communications, co-packaged optics is a promising solution. When the three-dimensional (3D) IC and optic engines are integrated into the same package, the design of such systems in terms of signal integrity, power integrity, and electromagnetic …
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Methodologies, Architectures, and Prototypes for Scaling On- and Off-Chip Interconnects
… the end of Dennard scaling have driven modern computing systems to embrace parallelism, both within single chips and across multiple compute devices, in order to meet the growing computational demands. Efficient data movement, both on-chip and off-chip, has thus become increasingly critical. …
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Photonic integration of divacancy color centers in silicon carbide and heterogeneous integration of lithium niobate on III-V/Si substrates
Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2027-05-01