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Showing 1 to 1 of 1 for “"Chip-Scale Power Package"”.
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and …