Global ETD Search
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Showing 1 to 4 of 4 for “"Chip scale packaging"”.
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Gallium nitride high electron mobility transistors in chip scale packaging: evaluation of performance in radio frequency power amplifiers and thermomechanical reliability characterization
… of over 600 V, realized in cost effective chip scale packages, and with inherently low parasitic capacitances and inductances. In this work, two types of inexpensive commercially available AlGaN/GaN high electron mobility transistors (HEMTs) in chip scale packages are evaluated in a set of …
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Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device
… modules such as Electronic Control Unit (ECU). Chip scale packaging (CSP) technology offer promising solution for packaging power electronics. This is as a result of the technology’s relatively improved thermal performance and inherent size advantage. In CSP technology, heat removal from …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and …