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Showing 1 to 2 of 2 for “"Chip embedding"”.
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Stresses and strain in silicon: 3-dimensional analytical capabilities for the non-invasive evaluation of strain fields in Si wafers and packaged chips
IC manufacturing and chip embedding processes can induce stresses in Si, which have the potential to affect device functionality and reliability and ultimately lead to device failure. One of the challenges for the future of semiconductor manufacturing and chip packaging is the development of …
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High-frequency characterization of embedded components in printed circuit boards
The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the …