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Showing 1 to 13 of 13 for “"Chemical mechanical planarization (CMP)"”.
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Copper Surface Chemistry Relevant to Chemical Mechanical Planarization (Cmp)
… (TAZ) on copper removal rate during CMP. Removal rates were higher for solutions containing TAZ than solutions containing BTA. The corrosion inhibitor films were characterized using AFM, cyclic voltammetry, impedance spectroscopy, surface-enhanced Raman spectroscopy, and mass …
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Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)
… to predict silica-specific instability in chemical-mechanical polishing (CMP) slurries. In CMP, the formation of large agglomerates is of great concern, as these large particles are associated with high defectivity and poor polishing performance. The proposed model describes the complex CMP …
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Modeling of pattern dependencies in the fabrication of multilevel copper metallization
… in various processes, especially copper Electrochemical Deposition (ECD) and Chemical-Mechanical Planarization (CMP), is a major problem in interconnects. An integrated pattern dependent chip-scale model for multilevel copper metallization is contributed to help understand and meet dishing and …
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Electrodeposition of Copper on Ruthenium Oxides and Bimetallic Corrosion of Copper/Ruthenium in Polyphenolic Antioxidants
… oxides can be formed by applying electrochemical potential. Investigation of Cu under potential deposition on these oxides indicates the similarity between native and reversible oxides by its nature of inhibiting Cu deposition. Irreversible oxide formed on Ru surface is rather conductive …
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Effect of chemical mechanical planarization processing conditions on polyurethane pad properties
Chemical Mechanical Planarization (CMP) is a vital process used in the semiconductor industry to isolate and connect individual transistors on a chip. However, many of the fundamental mechanisms of the process are yet to be fully understood and defined. The difficulty in analyzing the CMP process …
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Physical understanding and modeling of chemical mechanical planarization in dielectric materials
Chemical mechanical planarization (CMP) has become the enabling planarization technique of choice for current and emerging silicon integrated circuit (IC) fabrication processes. This work studies CMP in dielectric materials in particular, which is widely used in device formation for isolation and …
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Study of Copper Electrodeposition on Ruthenium Oxide Surfaces and Bimetallic Corrosion of Copper/Ruthenium in Gallic Acid Solution
… kinds of oxides, which are native oxide, electrochemical reversible oxide and electrochemical irreversible oxide. Native oxide was formed by naturally exposed to air. Electrochemical reversible oxide was formed at lower anodic potential region, and irreversible oxides were formed at higher anodic …
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Control of wafer-scale non-uniformity in chemical-mechanical planarization by face-up polishing
Chemical-mechanical planarization (CMP) is a key process in the manufacture of ultra-large-scale-integrated (ULSI) semiconductor devices. A major concern in CMP is non-uniform planarization, or polishing, at the wafer-scale - primarily as interconnect metal dishing and dielectric erosion. In …
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Multi-scale models for wafer surface evolution in chemical mechanical planarization
… size decreases and circuit density increases, planarization technology becomes more and more important in semiconductor fabrication. Chemical mechanical planarization (CMP) has emerged as a new promising technique for its capability to achieve better local and global planarization of wafer …
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Heterogeneous Sensor Data based Online Quality Assurance for Advanced Manufacturing using Spatiotemporal Modeling
… filament fabrication (FFF), binder jetting, chemical mechanical planarization (CMP), and the slicing process in wafer production, are investigated in this dissertation for applications of online quality assurance, with utilization of various sensors, such as thermocouples, infrared …
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Slurry Chemistry Effects On Copper Chemical Mechanical Planarization
Chemical-mechanical Planarization (CMP) has emerged as one of the fastest-growing processes in the semiconductor manufacturing industry, and it is expected to show equally explosive growth in the future (Braun, 2001). The development of CMP has been fueled by the introduction of copper …
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Development of Low-power Wireless Sensor Nodes based on Assembled Nanowire Devices
… including: environmental monitoring of chemical/biological attacks; condition-based maintenance of vehicles, ships and aircraft; real-time monitoring of civil infrastructure including roads, bridges etc.; security and surveillance for homeland defense systems; and battlefield …
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Surface Chemistry Of Application Specific Pads And Copper Chemical Mechanical Planarization
… material are key issues in the IC industries. Chemical mechanical planarization of copper (CuCMP) has emerged as an important process for the manufacturing of ICs. Usually, Cu-CMP process consists of several steps such as the removal of surface layer by mechanical action of the pad and the …