Global ETD Search

Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.

Results

Showing 1 to 3 of 3 for “"Bond Shear Strength"”.

  1. BOND STRENGTH EVALUATION IN ADHESIVE JOINTS USING NDE AND DIC METHODS

    Adhesive bonding of graphite epoxy composite laminates to itself or traditional metal alloys in modern aerospace and aircraft structural applications offers an excellent opportunity to use the most efficient and intelligent combination of materials available thus providing an attractive package for …

    siu-theses Repository record for BOND STRENGTH EVALUATION IN ADHESIVE JOINTS USING NDE AND DIC METHODS (opens in a new tab)

  2. Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging

    … limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The …

    arkansas Repository record for Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging (opens in a new tab)

  3. Adhesive Bonding of Low Moisture Hickory Veneer with Soy-based Adhesive

    … sapwood within hickory engineered wood flooring bonded with soy-flour adhesive are thought to be factors leading to potential performance deficiencies. The goal of this research was to gain a broader understanding of bonding low moisture hickory veneer with soy-based adhesive. Soyad® is of …

    vt Repository record for Adhesive Bonding of Low Moisture Hickory Veneer with Soy-based Adhesive (opens in a new tab)