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Showing 1 to 1 of 1 for “"Board-level reliability"”.

  1. Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections

    … lengths, higher component densities and system reliability enabled by the tailorable coefficient of thermal expansion (CTE), high dimensional stability and surface smoothness, outstanding electrical properties and low-cost panel-level processability of glass. The research objectives are to …

    gatech Repository record for Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections (opens in a new tab)