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Showing 1 to 2 of 2 for “"Bi segregation"”.
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Roles of Interfacial Reaction on Mechanical Properties of Solder Interfaces
In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were …
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Hypoeutectic low/ultra low temperature BGA Interconnection by SLID
… haute température par des systèmes à base de Sn-Bi et de Sn-In traités sous 180 °C et 140 °C, tout en préservant l’intégrité mécanique et structurelle. Un procédé SLID à basse température combinant des billes SAC305 et une pâte Sn-58Bi a été optimisé (volume, température, durée), produisant des …