Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 6 of 6 for “"Back-surface field"”.
-
PULSED LASER PROCESSING FOR HIGH EFFICIENCY SILICON WAFER SOLAR CELLS
… lasers in the fabrication of aluminium local back surface field (Al-LBSF) solar cells. The work predominantly focuses on laser induced damage to the silicon and post-laser methods that mitigate the impact of laser induced defects on the final solar cell performance. Finally optimised laser …
-
Silicon bottom subcell fabrication, loss analysis and shunt identification for two-terminal multijunction solar cells
… bottom silicon subcells. A low-capex, local area back-surface field, silicon cell is adapted for operation in a two-terminal perovskite-silicon tandem device. A contactless voltage loss analysis methodology is developed, and used to optimize the tunnel junction of the device. Finally, a general …
-
Heterojunction A1GaAs-GaAs solar cells for space applications
… structure with GaAs/AlGaAs heterojunction back surface field (triple heterojunction(TIIJ))-to enhance the performance of the existed double heterojunction solar cell- is proposed. The analytical model for this TIU cell is presented as a function of all the cell's design parameters ( such as …
-
Contact resistance study on polycrystalline silicon thin-film solar cells on glass
… investigation of the contact resistance of the back surface field and emitter layers of different types of poly-Si thin-film solar cells. Finally, a novel contact resistance measurement model is proposed that is believed to be able to overcome the measurement bottleneck of the transmission line …
-
Pulsed Laser Dielectric Ablation for Copper-plated Silicon Solar Cells
… pulses and textured silicon nitride (SiNx)/Si surfaces. It is shown that picosecond laser pulses of the longer wavelength of 532 nm result in melting depths of ~ 1 µm and the SiNx being primarily ablated by the indirect ‘spallation’ process, whereas for 266 nm pulses melting depths are …