Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 4 of 4 for “"BGA package"”.
-
Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life
… on the fatigue life of Ball Grid Array (BGA) packages that are subjected to thermal cycling is investigated in this study. A finite element model is created using Ansys by assuming the existence of an infinite array of solder interconnects, cylindrical in shape, surrounded by underfill …
-
Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
… system scaling. In this regard, 3D glass system packages have emerged as a promising alternative due to their ultra-short system interconnection lengths, higher component densities and system reliability enabled by the tailorable coefficient of thermal expansion (CTE), high dimensional stability …
-
Impact of product design choices on supply chain performance in the notebook computer industry
… for processors utilizing a ball-grid-array (BGA) package in notebook computers, which is the lower cost, smaller size packaging technology available today. This project was initiated to understand why with such a seemingly favorable environment for BGA, it still represents a small minority of …
-
Optimalizace teplotních profilů na zařízení IR-400
… byly optimalizovány teplotní profily pro opravy BGA pouzder u grafických karet při použití olovnaté i bezolovnaté pájky.