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Showing 1 to 1 of 1 for “"BGA balling"”.
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Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
… directly mounted on PCB with conventional BGAs at pitches of 400µm SMT and smaller. Two key innovations are introduced to accomplish the objectives: a.) Reworkable circumferential polymer collars providing strain-relief at critical high stress concentration areas in the solder joints, b.) …