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Showing 1 to 20 of 32 for “"BGA"”.

  1. Modal based BGA modeling in high-speed package

    … A π topology equivalent circuit model for the BGA structure is built. Good agreement between the equivalent circuit model and full wave simulation can be achieved up to 40GHz.</p><p>In the Section 3, the proximity effect for BGAs between parallel plates is carefully considered. A modal-based …

    must-thes Repository record for Modal based BGA modeling in high-speed package (opens in a new tab)

  2. Hypoeutectic low/ultra low temperature BGA Interconnection by SLID

    Cette recherche doctorale a développé et validé des stratégies de diffusion solide-liquide (SLID) permettant un brasage fiable à basse et ultra-basse température pour l’encapsulation microélectronique avancée. L’objectif était de remplacer le refusionnement SAC à haute température par des systèmes …

    sherbrooke Repository record for Hypoeutectic low/ultra low temperature BGA Interconnection by SLID (opens in a new tab)

  3. Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life

    … on the fatigue life of Ball Grid Array (BGA) packages that are subjected to thermal cycling is investigated in this study. A finite element model is created using Ansys by assuming the existence of an infinite array of solder interconnects, cylindrical in shape, surrounded by underfill …

    uno Repository record for Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life (opens in a new tab)

  4. Reliability evaluation of stacked die BGA assemblies under mechanical bending loads

    … evaluation of stacked die ball grid array (BGA) assemblies under mechanical bending loads. The test specimens used in this investigation were four die stacked BGAs assembled on printed circuit boards (PCBs) with eutectic tin-lead solder and gold over nickel finishes, both as-reflowed and …

    maryland Repository record for Reliability evaluation of stacked die BGA assemblies under mechanical bending loads (opens in a new tab)

  5. Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections

    … directly mounted on PCB with conventional BGAs at pitches of 400µm SMT and smaller. Two key innovations are introduced to accomplish the objectives: a.) Reworkable circumferential polymer collars providing strain-relief at critical high stress concentration areas in the solder joints, b.) …

    gatech Repository record for Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections (opens in a new tab)

  6. Development of a process for the production of fluxless solder spheres for BGA electronics packaging

    … the production of fluxless solder spheres for BGA (Ball Grid Array) microelectronics packaging technology. The Uniform Droplet Spray (UDS) process produces solder spheres by controlling the breakup of a continuous laminar jet into uniform droplets. which are then rapidly solidified in a liquid …

    mit Repository record for Development of a process for the production of fluxless solder spheres for BGA electronics packaging (opens in a new tab)

  7. Control of the UDS process for the production of solder balls for BGA electronics packaging

    Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1997.

    mit Repository record for Control of the UDS process for the production of solder balls for BGA electronics packaging (opens in a new tab)

  8. Bucky gel actuator for morphing applications

    Since the demonstration of Bucky Gel Actuator (BGA) in 2005, a great deal of effort has been exerted to develop novel applications for electro-active morphing materials. Three-layered bimorph nanocomposite has become an excellent candidate for morphing applications since it can be easily …

    lsu-thes Repository record for Bucky gel actuator for morphing applications (opens in a new tab)

  9. Impact of shipping Ball-Grid-Array Notebook processors in tape and reel on the PC supply chain

    … in PGA (Pin Grid Array) and 10% are packaged in BGA (Ball Grid Array). Intel has recently made a decision to transform the notebook industry by creating a new system size category called Ultrabook TM . In order to create such a thin form factor, PGA (Pin Grid Array) CPUs must now be offered as …

    mit Repository record for Impact of shipping Ball-Grid-Array Notebook processors in tape and reel on the PC supply chain (opens in a new tab)

  10. Analýza závad na DPS pomocí X-RAY

    Diplomová práce je zaměřena na BGA (Ball Grid Array) pouzdra a detekci chyb vzniklých při jejich opravách pomocí rentgenového záření. Popisuje obecně BGA pouzdra podle druhu nosného substrátu, techniky připojování čipů, přes montáž samotných pouzder až po proces opravy desek plošných spojů (dále …

    brno-tech Repository record for Analýza závad na DPS pomocí X-RAY (opens in a new tab)

  11. The effect of feeding varying levels of Bifidobacterium globsum a on the performance, scouring index, gastrointestinal measurements and immunity of weanling and growing-finishing pigs

    … the effectiveness of Bifidobacterium globsum a (BGA) on the growth performance, scour scores, humoral and cell-mediated immune response and pH and chloride ion concentration (CIC) of feces and gastrointestinal section contents. The effect of continuous feeding of BGA from weaning to market weight …

    vt Repository record for The effect of feeding varying levels of Bifidobacterium globsum a on the performance, scouring index, gastrointestinal measurements and immunity of weanling and growing-finishing pigs (opens in a new tab)

  12. Impact of product design choices on supply chain performance in the notebook computer industry

    … for processors utilizing a ball-grid-array (BGA) package in notebook computers, which is the lower cost, smaller size packaging technology available today. This project was initiated to understand why with such a seemingly favorable environment for BGA, it still represents a small minority of …

    mit Repository record for Impact of product design choices on supply chain performance in the notebook computer industry (opens in a new tab)

  13. Design of a container for the collection of solder balls produced by the Uniform Droplet Spray (UDS) process

    … is thought to be a solution. Ball Grid Array (BGA) packaging, a type of surface mount package, provides more 1/0 connections while increasing the reliability and decreasing the size of the electronics component. BGA packaging is an interconnection technology that uses an array of small uniform …

    mit Repository record for Design of a container for the collection of solder balls produced by the Uniform Droplet Spray (UDS) process (opens in a new tab)

  14. Contact-type mechanical interfaces for high speed digital interconnects

    … to determine the feasibility of Ball Grid Array (BGA) planarization and to investigate the effects of mechanical contacts on signal integrity for high­speed digital signals. As devices become smaller and clock frequencies increase, new technologies for contacting devices are being developed, …

    mit Repository record for Contact-type mechanical interfaces for high speed digital interconnects (opens in a new tab)

  15. Development of optical fiber laser array method for assessing quality of chip packages

    … open solder bumps, etc.) in ball grid array (BGA) packages supplied by CISCO. Various types of defects were induced in these packages by bend, shock, and cycle shock tests. The results obtained with this new system were validated with results obtained through cross sectioning and polishing of …

    gatech Repository record for Development of optical fiber laser array method for assessing quality of chip packages (opens in a new tab)

  16. Optimalizace teplotních profilů na zařízení IR-400

    … byly optimalizovány teplotní profily pro opravy BGA pouzder u grafických karet při použití olovnaté i bezolovnaté pájky.

    brno-tech Repository record for Optimalizace teplotních profilů na zařízení IR-400 (opens in a new tab)

  17. Ancestry Informative Markers Tailored to Hispanic Populations

    … SNPs were selected for biogeographic ancestry (BGA) determination by tailoring each SNP to genetic differentiation of specific populations. Accuracy of BGA prediction was tested using multinomial logistic regression (MLR) and as few as 55 SNPs were robust to 90% for all populations studied. The …

    tdl Repository record for Ancestry Informative Markers Tailored to Hispanic Populations (opens in a new tab)

  18. Neural dynamics supporting flexible cognition

    … reveal a mosaic of broadband gamma activation (BGA) for music and language within the superior temporal gyrus. Finally, we examined local and inter-areal directed communication to characterize frontoparietal and fusiform network dynamics underlying flexible attention to visual objects. By …

    uthsc Repository record for Neural dynamics supporting flexible cognition (opens in a new tab)

  19. Neurokinin-1 antagonism as a novel treatment for feline asthma : investigation of the role of substance p in airflow limitation and airway inflammation

    … to have asthma using Bermuda grass allergen (BGA) were studied. Twenty-four hours after aerosol challenge of BGA, cats were anesthetized and aerosols of saline followed by 10 fold increasing concentrations of capsaicin (0.4 to 4000 [mu]M) were nebulized. This was followed by ventilator …

    missouri Repository record for Neurokinin-1 antagonism as a novel treatment for feline asthma : investigation of the role of substance p in airflow limitation and airway inflammation (opens in a new tab)

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