Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 6 of 6 for “"3D packaging"”.
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The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules
<p>This dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power …
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Numerical modelling of electrodeposition process for printed circuit boards manufacturing
… particularly for high technology products (e.g., 3D packaging), is to manufacture PCBs with high aspect ratio (AR) vias. Typically, the size of such a via is at the micrometer scale (this is why they are termed micro-vias). The most widely used technique for manufacturing micro-vias is …
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Integrated Thermal Management Strategies for Embedded Power Electronic Modules
… and offer the advantage of three-dimensional (3D) packaging of electronic components in a small and compact volume, replacing the traditional wire bonding technology. They have the potential to offer reduced time and effort associated with developing and manufacturing power processors. However, …
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Non-destructive evaluation of solder joint reliability
… A comprehensive review of current and emerging packaging and interconnect technologies has shown increasingly a move from conventional 2D to 3D packaging. These present new challenges for reliability and Non Destructive Evaluation (NDE) due to solder joints being hidden beneath the packaging, …
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Electrochemical materials for integrated magnetics
… (IoT). Microinductor VIAs enable monolithic 3D device topologies with reduced footprint, increased inductance density and minimal parasitics. These qualities are essential for emerging 2.5/3D packaging architectures that require granular point-of-load (PoL) power delivery to efficiently …
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Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
… is pushing the limits of current wire bonding packaging technology. Emerging three-dimensional power packaging techniques have shown their potential to replace wire bonding technology down the road. However, these innovative technologies have not yet been fully understood in terms of thermal …