Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 8 of 8 for “"3D integrated circuit"”.
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Architecture and CAD for Nanoscale and Three-Dimensional FPGA
To maximize the potential performance gain of 3D integrated circuit architectures, an SSTA engine was developed to deal with both uncorrelated and correlated variations in 3D FPGAs. The effects of intra-die and inter-die variation are considered. Using the 3D physical design tool TPR as a base, a …
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A framework for analog circuit optimization
… presents a system for optimization of analog circuit topologies and component values. The topology is optimized using simulated annealing, while the component values are optimized using gradient descent. Local minima are avoided and constraints are kept through the use of coordinate …
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Asynchronous 3D (Async3D): Design Methodology and Analysis of 3D Asynchronous Circuits
… dissertation focuses on the application of 3D integrated circuit (IC) technology on asynchronous logic paradigms, mainly NULL Convention Logic (NCL) and Multi-Threshold NCL (MTNCL). It presents the Async3D tool flow and library for NCL and MTNCL 3D ICs. It also analyzes NCL and MTNCL …
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ELECTRONIC DESIGN AUTOMATION TOOLS AND DESIGN STUDY FOR HETEROGENEOUS MONOLITHIC 3D INTEGRATED CIRCUITS
… the transistor performance, Three Dimensional (3D) Integrated Circuit (IC) Design, which is the focus of this work, is another promising alternative for going beyond Moore’s Law. 3D IC provides power, performance, and area (PPA) benefits at full-chip level, orthogonal to the transistor …
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Architecture and CAD for nanoscale and 3d FPGA
… compared to ASICs (application-specific integrated circuits) for significantly lowering amortized manufacturing costs and dramatically improving design productivity. The architecture of an FPGA is very regular. It is relatively easy to design a highly optimized tile, with consideration of …
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Interconnect design techniques for multicore and 3D Integrated circuits.
… and wire dimensions. Three dimensional (3D) circuit technology, with multiple tiers of active devices stacked above each other, is a key approach to achieve increasing levels of integration and performance in the future. Concomitant with exponentially reducing device dimensions, designers …
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3D modeling and integration of current and future interconnect technologies
To ensure maximum circuit reliability it is very important to estimate the circuit performance and signal integrity in the circuit design phase. A full phase simulation for performance estimation of a large-scale circuit not only require a massive computational resource but also need a lot of time …