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Showing 1 to 1 of 1 for “"3D SIC"”.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
… to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long …