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Showing 1 to 1 of 1 for “"3D NAND; Micron; High Stress; Thermal Stability"”.
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ADVANCED MATERIALS DEVELOPMENT AND MANUFACTURING - DEVELOPMENT OF THERMALLY STABLE THIN FILMS WITH HIGH STRESS TUNABILITY
… the semiconductor industry is heading towards 3D integrated circuits by stacking die or NAND cells vertically. The higher number of film deposition from NAND cell stacking result in higher compressive wafer bow of Production Silicon Wafers which is undesirable in manufacturing process flow due …