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Showing 1 to 2 of 2 for “"3D Die-Stacking"”.
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Efficient memory access in modern accelerators
Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2024-05-01
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Opportunistic power reassignment between processor and memory in 3D stacks
… which is often comparable to the cost of a die. In 3D processor-memory designs, power and ground (P/G) pins can account for the majority of the pins. This is because packages include separate pins for the disjoint processor and memory power delivery networks (PDNs). Supporting separate PDNs …