Back to search

Virginia Polytechnic Institute and State University

Study of diffusion damage in the copper-nickel system

Abstract

dc:description.abstract

Study of prolonged diffusion in Cu-Au and Cu-Pd systems has revealed that the diffusion generated misorientations tend to mend themselves because of reduced concentration gradients. Previous studies of the Cu-Ni system in which a 8.0 micron nickel plated single crystal copper was diffused up to 5 hours at 900°C, did not reveal such features. It was desirable to obtain more information on the structure oriented diffusion of this system at prolonged diffusion times. For this purpose a 3.0 micron nickel plated copper single crystal was subjected to diffusion anneals at 900°C for times as long as 7 hours. The diffusion and structure data were obtained by the nondestructive X-ray method with supporting measurements using a Scanning Electron Microscope and computer simulations. It has been found that the diffusion behavior is dynamic and is influenced by structure. At lower times a unified grain boundary-volume diffusion model is able to account for the diffusion behavior whereas at intermediate and higher times a volume diffusion model with anomalously varying range of pseudo diffusion coefficients is required to match the experimental intensity patterns. Scanning Electron Microscope studies made at the end of the six different anneals show extensive flow patterns and porosities indicative of structural modifications. Rocking curve measurements obtained at chosen compositions over the treatments indicate no tendency of reorientation of the structure; the variance and halfwidth analysis demonstrate this feature. In fact, strong indications of the structure, having undergone a recrystallization are revealed at the end of the last diffusion anneal.

Degree

thesis:*
Name thesis:degree_name
Master of Science
Level thesis:degree_level
masters
Discipline thesis:degree_discipline
Metallurgical Engineering
Department dc:contributor.department
Metallurgical Engineering
Grantor dc:publisher
Virginia Polytechnic Institute and State University
Year dc:date.issued
1974

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Subbaraman, Ganesan

Rights

dc:rights
Statement dc:rights
  • In Copyright
Language dc:language.iso
en

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/10919/74118
OAI identifier oai:identifier
oai:vtechworks.lib.vt.edu:10919/74118

Chain of custody

source
Harvested from
Virginia Tech
Base URL
vtechworks.lib.vt.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
related terms
citation

Subbaraman, Ganesan. Study of diffusion damage in the copper-nickel system. masters thesis, Virginia Polytechnic Institute and State University, 1974. http://hdl.handle.net/10919/74118