Electrical characterization of a multilayer low temperature co-fireable ceramic multichip module

The purpose of this research is to develop an understanding of Multichip Modules, (MCMs), more specific those fabricated with a Low Temperature Co-fireable Ceramic (L TCC) tape systems. The study will consist of designing, processing, and testing two generic MCM test patterns. The effects on signal propagation caused by vias and wire bonds, crosstalk for surface and embedded transmission lines, crosstalk between vias, effects of bends in transmission lines are studied and discussed in this work. Time Domain and Frequency Domain measurements are performed and presented in this thesis work for electrical characterization of MCM structures using L TCC systems

Name thesis:degree_name

Master of Science

Level thesis:degree_level

masters

Discipline thesis:degree_discipline

Electrical Engineering

Department dc:contributor.department

Electrical Engineering

Grantor dc:publisher

Virginia Tech

Year dc:date.issued

1994

Author dc:creator

• Barton, Cecil Edward

Chair dc:contributor.committeechair

• Elshabini-Riad, Aicha A.

Committee members dc:contributor.committeemember

• Riad, Sedki Mohamed
• Besieris, Ioannis M.

Statement dc:rights

• In Copyright

Licence dc:rights.uri

• http://rightsstatements.org/vocab/InC/1.0/

Language dc:language.iso

en

Dc Identifier Other

etd-09052009-040727

OAI identifier oai:identifier

oai:vtechworks.lib.vt.edu:10919/44595