Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers

This thesis describes the design and execution of experiments suitable for extracting quantitative information needed for numerical simulation of the effect of plating solution additives on copper nucleation on ruthenium films. This investigation contributes procedures for quantitative characterization of the effect of additives on early stages of copper electrodeposition on ruthenium substrates. Such procedures will enable improved engineering methods for prediction, design, control, and optimization of electrodeposition processes for growth of thin films on foreign substrates.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Chemical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Younker, Jennifer Lauren

Contributors dc:contributor

• Alkire, Richard C.

• Engineering, Chemical

Language dc:language

eng

Identifier

(MiAaPQ)AAI3347567

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/82419