Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.

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North Carolina State University

dc:creator Melamed, Samson

dc:date.issued2011

Abstract

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North Carolina State University Theses Electrical Engineering.

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Author dc:creator: Melamed, Samson
Advisors dc:contributor.advisor: William Davis, Chair
Paul Franzon, Member
Michael Steer, Member
Donald Bitzer, Member

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Dc Identifier Other: deg807
OAI record oai:identifier: https://repository.lib.ncsu.edu/server/oai/request?verb=GetRecord&metadataPrefix=dim&identifier=oai%3Arepository.lib.ncsu.edu%3A1840.16%2F6977

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Melamed, Samson. Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.. 2011. http://www.lib.ncsu.edu/resolver/1840.16/6977