Massachusetts Institute of Technology
Development of a precision hot embossing machine with in-process sensing
Abstract
dc:description.abstractMicrouidic technologies show great promise in simplifying and speeding biological, medical, and fluidic tasks, but transitioning these technologies from a laboratory environment to a production environment has proven difficult. This work focuses on hot embossing as a process suitable to produce these devices. In this work, a precision micro-embossing machine capable of maintaining precise setpoints in force and temperature input as well as displaying highly linear, repeatable motion and force application is developed and characterized. Additionally, this equipment is then outfitted with additional sensors that allow for three measurements relevant to process physics and product quality to be captured: initial substrate geometry; substrate bulk deformation; and glass transition temperature of the material. These measurements can be captured in-process without modifying the production cycle. The end goal is to incorporate this precision micro-embossing machine into a micro-factory cell and to implement closed-loop cycle-to-cycle process control.
Degree
thesis:*- Department dc:contributor.department
- Massachusetts Institute of Technology. Department of Mechanical Engineering.
- Grantor dc:publisher
- Massachusetts Institute of Technology
- Year dc:date.issued
- 2013
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Bageant, Maia R. (Maia Reynolds)
- Advisor dc:contributor.advisor
-
- David Hardt.
Subjects
dc:subject × 1Rights
dc:rights- Statement dc:rights
-
- M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
- Licence dc:rights.uri
- Language dc:language.iso
- eng
Identifiers
dc:identifier.*- Handle dc:identifier.uri
- http://hdl.handle.net/1721.1/81732
- OAI identifier oai:identifier
- oai:dspace.mit.edu:1721.1/81732