Effects of thermal cycling on epoxy bonded materials

Thermal cycling is a concern to those who use epoxy as an adhesion in space applications due to the mechanical and thermal properties of both the epoxy and adhered materials. These properties include the thermal expansion coefficient, a, and the stress at which the epoxy will yield fracture. An experiment was carried out to find out if failure would occur by thermal cycling of epoxy bonded components in the propulsion components of a small satellite. Failure did not occur due to shear stress attributed to the thermal expansion coefficient but unexpectedly to the liquefaction of epoxy in 3 of the 6 samples. The samples with thicker epoxy layers failed in contrast to the thinner epoxy layer samples. Overall, thermal cycling is still a concern for failure of the epoxy bond.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Mechanical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2011

Author dc:creator

• Burroughs, Michelle (Michelle L.)

Advisor dc:contributor.advisor

• Paulo Lozano.

• Mechanical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/69505

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/69505