The development of an innovative bonding method for microfluidic applications

The field of microfluidics has powerful applications in low-cost healthcare diagnostics, DNA analysis, and fuel cells, among others. As the field moves towards commercialization, the ability to robustly manufacture these devices at low cost is becoming more important. One of the many challenges in microfluidic manufacturing is the reliable sealing of the microfluidic chips once the channels have been generated. This work was an investigation of innovative ways to robustly heat the substrate-cover plate interface of a microfluidic device for the purpose of bonding and sealing the microfluidic channels. An extensive literature review revealed the benefits of interfacial heating, and both simulations and experimental investigations were used to evaluate a few different methods. Ultimately, a unique method was established that uses light to provide both the bonding energy and the illumination for an in-process vision system for real-time viewing and control of the bonding process. The process results in the generation of a homogenous and optically clear bond, and preliminary tests show that when properly controlled, a bond with minimal microchannel deformation can be created.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Mechanical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2011

Author dc:creator

• Lustrino, Michelle E. (Michelle Elizabeth)

Advisor dc:contributor.advisor

• David E. Hardt.

• Mechanical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/67622

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/67622