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Massachusetts Institute of Technology

Achieving Six Sigma printed circuit board yields by improving incoming component quality and using a PCBA prioritization algorithm

Abstract

dc:description.abstract

Printed circuit board assemblies (PCBAs) are the backbone of the electronics industry. PCBA technologies are keeping pace with Moore's Law and will soon enable the convergence of video, voice, data, and mobility onto a single device. With the rapid advancements in product and component technologies, manufacturing tests are being pushed to the limits as consumers are demanding higher quality and more reliable electronics than ever before. Cisco Systems, Inc. (Cisco) currently manufactures over one thousand different types of printed circuit board assemblies (PCBAs) per quarter all over the world. Each PCBA in Cisco's portfolio has an associated complexity to its design determined by the number of interconnects, components, and other variables. PCBA manufacturing yields have historically been quite variable. In order to remain competitive, there is an imminent need to attain Six Sigma PCBA yields while controlling capital expenditures and innovating manufacturing test development and execution. Recently, Cisco kicked off the Test Excellence initiative to improve overall PCBA manufacturing yields and provided the backdrop to this work study. This thesis provides a first step on the journey to attaining Six Sigma PCBA manufacturing yields. Using Six Sigma techniques, two hypotheses are developed that will enable yield improvements: (1) PCBA yields can be improved by optimizing component selection across the product portfolio by analyzing component cost and quality levels, and (2) Using the Six Sigma DMAIC (define-measure-analyze-improve-control) method and the TOPSIS (Technique for Order Preferences by Similarity to Ideal Solutions) algorithm, PCBA yields will improve by optimally prioritizing manufacturing resources on the most important PCBAs first.

Degree

thesis:*
Department dc:contributor.department
Leaders for Manufacturing Program at MIT
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2008

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Davis, Daniel Jacob
Advisor dc:contributor.advisor
  • David Hardt and Roy Welsch.

Subjects

dc:subject × 3

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/43831
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/43831

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Davis, Daniel Jacob. Achieving Six Sigma printed circuit board yields by improving incoming component quality and using a PCBA prioritization algorithm. Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/43831