Commercial applications of nanostructures created with ordered porous alumina

In the drive from microfabrication to nanofabrication, porous alumina templates may play a key role in technological evolution. Under the right processing conditions, ordered pores can grow in anodic aluminum oxide, which is a high strength, thermally and electrically insulating material. There are many potential applications for porous alumina templates, ranging from the simple fabrication of nanostructure arrays to the more complex processing of components for end-user products such as nano-integrated circuits and gas sensors. Porous alumina templates can also be processed to have long-range pore ordering on an entire twelve-inch silicon wafer, which may be of unique benefit to processes requiring such pore precision, such as parallel electron beam lithography. The high aspect ratios which can be attained through porous alumina template technology may also offer unique advantages in applications such as field-emission-based devices. As a durable high strength material, porous alumina templates are not limited by extreme process conditions, further extending the reach of their application. The vast array of applications allows the technology to be financially attractive inside business models ranging from sustaining to disruptive innovation. Porous alumina template technology has the necessary multitude and diversity of attributes to play a crucial role in the future of nanotechnology.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2004

Author dc:creator

• Wells, Brendan Christopher, 1979-

Advisor dc:contributor.advisor

• Carl V. Thompson, II.

• Materials Science and Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

en_US

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/28875

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/28875