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Massachusetts Institute of Technology

Machine Learning Methods for Automated Macro-Inspection and Improved Defect Identification in Semiconductor Manufacturing

Abstract

dc:description.abstract

This thesis proposes four methods to improve macro-inspection capability of defects on wafers at a semiconductor wafer fab. First, an investigation into the performance of current inspection tools is done, revealing results that are not reliable nor reproducible. Tool maintenance procedures and specification adjustments are recommended. Second, a software upgrade to the current inspection software is developed, including enhanced features that address pain points of reviewing wafer images. The image processing and loading time is reduced by over 50%. Third, three binary classification machine learning models are trained to isolate spin-on-glass defects, edge type defects, and center defects. Each of the models exhibits an area under curve (AUC) of over 0.90 on out-of-distribution test sets. Finally, a proof-of-concept for an in-line inspection system is designed and tested on the fab floor. New images from this system appear to be of sufficient quality for inspection. The results of each part of this study can be used to inform investment decisions required to move towards a more automated process. Relevant to the machine learning community are the methods developed to address class imbalance in neural network training. Methods for preparing data to be trained in a meaningful way such as spitting, transforming, and creating synthetic data are proposed. The effect of generating data in such a fashion is shown to be positive, increasing the AUC of the specified model by up to 65%.

Degree

thesis:*
Name thesis:degree_name
Master
Department dc:contributor.department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2023

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Cheung, Sophia
Advisors dc:contributor.advisor
  • Boning, Duane
  • Hardt, David E.

Rights

dc:rights
Statement dc:rights
  • In Copyright - Educational Use Permitted
  • Copyright retained by author(s)

Identifiers

dc:identifier.*
Handle dc:identifier.uri
https://hdl.handle.net/1721.1/152700
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/152700

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
related terms
citation

Cheung, Sophia. Machine Learning Methods for Automated Macro-Inspection and Improved Defect Identification in Semiconductor Manufacturing. Massachusetts Institute of Technology, 2023. https://hdl.handle.net/1721.1/152700